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dc.creatorQuinones, C. 
dc.creatorVallejo, W. 
dc.creatorMesa, F. 
dc.date.accessioned2020-08-06T16:20:24Z
dc.date.available2020-08-06T16:20:24Z
dc.date.created2011-06-15
dc.identifier.issnISSN: 0169-4332
dc.identifier.urihttps://repository.urosario.edu.co/handle/10336/25988
dc.description.abstract"In this work platinum thin films deposited by sputtering and electrochemicalmethods were characterized through physical and electrochemical analysis. The as-grown platinum thin films were characterized through X-ray diffraction (XRD), atomic force microscopy (AFM); scanning electronic microscopy (SEM) and through electrochemical impedance spectroscopy (EIS) measurements. Structural studies indicated that platinum thin films were polycrystalline. Morphological characteristics were significantly affected by the substrate type and synthesis method. Finally the EIS analysis indicated that platinum films were electrochemically stable and present both low resistance of charge transfer and low series resistance; the equivalent circuit of platinum interface has been proposed."
dc.format.mimetypeapplication/pdf
dc.language.isoeng
dc.relation.ispartofApplied Surface Science, Applications of Surface Science, ISSN: 0169-4332, Vol.257, No.17 ( 2011), pp.7545-7550
dc.relation.urihttps://www.sciencedirect.com/science/article/abs/pii/S0169433211004855
dc.sourceApplied Surface Science, Applications of Surface Science
dc.titlePhysical and electrochemical study of platinum thin films deposited by sputtering and electrochemical methods
dc.typearticle
dc.publisherElsevier
dc.subject.keywordPlatinum
dc.subject.keywordThin film
dc.subject.keywordCounter-electrode
dc.subject.keywordDSSC
dc.rights.accesRightsinfo:eu-repo/semantics/restrictedAccess
dc.type.spaArtículo
dc.rights.accesoRestringido (Acceso a grupos específicos)
dc.type.hasVersioninfo:eu-repo/semantics/publishedVersion
dc.identifier.doihttps://doi.org/10.1016/j.apsusc.2011.03.121
dc.title.TranslatedTitleEstudio físico y electroquímico de películas delgadas de platino depositadas por pulverización y métodos electroquímicos.
dc.relation.citationEndPage7550
dc.relation.citationIssueNo. 17
dc.relation.citationStartPage7545
dc.relation.citationTitleApplied Surface Science, Applications of Surface Science
dc.relation.citationVolumeVol. 257


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